Cabot Microelectronics' 2nd step glass slurry offerings consist of colloidal silica based formulations to planarize glass substrates. These formulations meet stringent polish requirements to provide ultra low surface roughness and low defects. Our glass slurries give excellent cleanability on post polish glass surfaces.
The table below compares the performance of our products for 2nd Step Glass polishing.
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Particles System |
Colloidal Silica-based |
Removal Rate |
High |
Surface Physical Properties |
Excellent |
CMC's "CMP For Metal-gate Integration" article in Solid State magazine.
For over twenty years of IC manufacturing, the creation of planar device structures has required the use of technologies to reduce topographic variation. Chemical mechanical planarization (CMP) - pressing wafers into rotating pads in the presence of special slurry blends to produce removal through chemically amplified nano-scale abrasion - has become a critical part of modern IC fabrication. Click here to read the full article.
Lustra™ G2000 Series