CMP Chemical Mechanical Planarization Slurry

Barrier CMP Polishing Slurries

As Barrier CMP focus shifts away from early process development to yield enhancement and cost-of-ownership reduction, polishing slurries assume a critical role, influencing both performance and total system cost. Our new line of Sentinelâ„¢ slurries for Barrier applications are low-k and Ruthenium compatible and designed to meet broad technical requirements.

Click on one of our Barrier CMP Solutions below to learn more.


CMC iCue B7000 Barrier CMP Slurry

i-Cue B7000 Series

CMC Sentinel B8000 Barrier CMP Slurry

Sentinel B8000 Series

CMC Sentinel B9000 Ruthenium Barrier CMP Slurry

Sentinel B9000 Series













CMC in Solid State Magazine

Chemical Mechanical Planarization For Metal-gate Integration

CMC's "CMP For Metal-gate Integration" article in Solid State magazine.

For over twenty years of IC manufacturing, the creation of planar device structures has required the use of technologies to reduce topographic variation. Chemical mechanical planarization (CMP) - pressing wafers into rotating pads in the presence of special slurry blends to produce removal through chemically amplified nano-scale abrasion - has become a critical part of modern IC fabrication. Click here to read the full article.