As Barrier CMP focus shifts away from early process development to yield enhancement and cost-of-ownership reduction, polishing slurries assume a critical role, influencing both performance and total system cost. Our new line of Sentinel™ slurries for Barrier applications are low-k and Ruthenium compatible and designed to meet broad technical requirements.
CMC's "CMP For Metal-gate Integration" article in Solid State magazine.
For over twenty years of IC manufacturing, the creation of planar device structures has required the use of technologies to reduce topographic variation. Chemical mechanical planarization (CMP) - pressing wafers into rotating pads in the presence of special slurry blends to produce removal through chemically amplified nano-scale abrasion - has become a critical part of modern IC fabrication. Click here to read the full article.