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CMP Polishing Pads

Pads inspection2 245x137Our Epic™ D100 and D200 Series CMP polishing pads are based on proprietary material technology and a state-of-the-art manufacturing process designed to improve pad performance, lower the cost of ownership and provide superior quality. The Polishing Pads consists of a single polymer component and are produced in a continuous single-sheet manufacturing process. The materials and technology behind CMC's CMP polishing pads are extensively patented by Cabot Microelectronics Corporation by an international portfolio of patents.

The unique material properties of the Epic D100 and D200 Series polishing pads result in significantly lower wear rates compared to the industry conventional pads, without any adverse impact on CMP performance or process stability. As a result, Epic D100 and D200 Series pad life is longer than conventional CMP pads available today.

Click on one of our products below to learn more.

 

CMC_D100_for_Cu_W_Al_and_SelectiveOxide CMC_D110_CU_for_Copper CMC_D120_STI_for_STI CMC_D150_W_for_Tungsten CMC_Pads_D200_Series CMC Pads Epic D260 Buff

 

 

 

 

 

 

 

 

 

 

 

 

 

  

 

 

 

 

 


 
 

 

 

Semi-SperseTM W2000

PRODUCTION PROVEN. INDUSTRY PREFERRED.

Semi Sperse w2000 Tungsten Slurry

Thank You for Choosing Semi-Sperse W2000 Tungsten Slurry

Cabot Microelectronics trusted for over 200 million liters of Semi-Sperse W2000 tungsten slurry provided to the semiconductor industry. We've reached this significant milestone because of our customers' confidence in CMC as the industry leader in tungsten polishing solutions.

>> Learn More about Semi-Sperse W2000

 

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