Our Offerings

CMP Slurries

As a pioneer in chemical mechanical planarization (CMP) slurries, Cabot Microelectronics commercialized our original Semi-Sperse^® products in the 1980s for 250nm applications. With continuous improvement of some of these slurries, enhanced versions are still in use and key to our customer solutions today, such as our flagship Semi-Sperse W2000 product for tungsten CMP. 

Over the years, we have successfully introduced a number of new CMP slurry platforms to meet our customers’ evolving CMP needs, while reducing overall cost of ownership. For example, our portfolio of iDIEL^® dielectrics slurries utilizes engineered particles and unique chemistries to achieve improved planarity while significantly reducing defectivity. 

Our next-generation tungsten slurries, with the WIN® brand name, are designed to enable significant planarization improvements for 65nm applications and beyond.  Our next-generation EPOCH^® line of copper slurries provides maximum flexibility to meet specific customer integration requirements.  Additionally, our new line of Sentinel™ slurries for barrier applications is low-k compatible and designed to meet broad technical requirements.  Serving the data storage industry, our Lustra^® and Transele^® product lines improve the surface finish and planarity of certain hard disk drive components. 

CMP Polishing Pads

Cabot Microelectronics Corporation is a growing supplier of CMP polishing pads, under the Epic^® brand name, for a wide range of applications and technology nodes.  Our Epic CMP polishing pads are the result of extensive research and development by CMC to deliver best-in-class performance at advanced technology nodes, quality improvements and optimal cost of ownership.  Cabot Microelectronics designed and developed a patented thermoplastic technology for continuously manufacturing CMP pads. This unique, continuous manufacturing process has attracted many customers, as it has proven to successfully reduce pad-to-pad variation.

Integrated circuit manufacturers have differing needs, driven by their specific CMP applications and the life cycle of their products.  The Epic D100 manufacturing process is flexible enough to allow the customization of our polishing pads and, as a result, the product portfolio now includes CMP polishing pads for all applications.

Our next generation Epic D200 CMP polishing pad has best-in-class defectivity with tunable resin hardness, pore size and porosity in order to meet the demanding need for advanced node applications.

Engineered Surface Finishes

Through our Engineered Surface Finishes businesses, we provide a number of precision polishing products, services and equipment across a range of industries.  For example, we sell automated polishing and metrology systems, which enable rapid, deterministic and repeatable surface correction for the most demanding precision optics applications.