CMP Chemical Mechanical Planarization Slurry

Copper CMP Polishing Slurries

As the leading supplier of Copper CMP slurries, Cabot Microelectronics is focused on developing products with yield enhancement and cost-of-ownership reduction.  Our Copper CMP polishing slurries assume a critical role, influencing both performance and total system cost. Our next-generation EPOCHâ„¢ line of Copper slurries provides maximum flexibility to meet specific customer integration requirements.   

Click on one of our Copper CMP Solutions below to learn more.


CMC iCue C7092 Copper CMP Slurry

i-Cue C7092

CMC EPOCH C8000 Copper CMP Slurry

EPOCH C8000 Series















CMC in Solid State Magazine

Chemical Mechanical Planarization For Metal-gate Integration

CMC's "CMP For Metal-gate Integration" article in Solid State magazine.

For over twenty years of IC manufacturing, the creation of planar device structures has required the use of technologies to reduce topographic variation. Chemical mechanical planarization (CMP) - pressing wafers into rotating pads in the presence of special slurry blends to produce removal through chemically amplified nano-scale abrasion - has become a critical part of modern IC fabrication. Click here to read the full article.