As the leading supplier of Copper CMP slurries, Cabot Microelectronics is focused on developing products with yield enhancement and cost-of-ownership reduction. Our Copper CMP polishing slurries assume a critical role, influencing both performance and total system cost. Our next-generation EPOCH™ line of Copper slurries provides maximum flexibility to meet specific customer integration requirements.
CMC's "CMP For Metal-gate Integration" article in Solid State magazine.
For over twenty years of IC manufacturing, the creation of planar device structures has required the use of technologies to reduce topographic variation. Chemical mechanical planarization (CMP) - pressing wafers into rotating pads in the presence of special slurry blends to produce removal through chemically amplified nano-scale abrasion - has become a critical part of modern IC fabrication. Click here to read the full article.