Engineered Surface Finishes

CMC Engineered Surface Finishes
Engineered Surface Finishes

Beyond our core CMP consumables and polishing pad expertise, Cabot Microelectronics provides state-of-the-art equipment and services for precision finishing and fabrication for a wide range of industries through our Engineered Surface Finishes business.  Please see our Surface Finishes and QED Technologies information for further detail.

 

CMC QED-Technologies

QED Technologies

  • State of the art deterministic finishing of precision optics and advanced sub-aperture stitching metrology including aspheric optics
  • Proprietary technology and equipment for finishing and measuring high-precision optics
CMC Surface Finishes

 

Surface Finishes

  • Leaders in high precision finishing and fabrication services since 1949
  • State-of-the-art lapping, low-stress grinding, honing and optical quality polishing for a variety of materials including metals, ceramics, glasses, and coatings
  • Custom fabrication, finishing, refurbishing and metrology services

 

 

Discover CMC's Chemical Mechanical Planarization Solutions

CMC Chemical Mechanical Planarization Corp Video Thumbnail 226X150

Cabot Microelectronics Corporation (CMC) is the world’s leading supplier of chemical mechanical planarization (CMP) slurries and a growing CMP pad supplier to the semiconductor industry. Our products are used to level, smooth and remove excess material from the multiple layers deposited upon silicon wafers in the production of semiconductor devices.   

 

Cabot Microelectronics Receives Intel's SCQI Award for 2012 

Intel SCQI Award for Cabot Microelectronics

Cabot Microelectronics Corporation, announced that it was named as one of only eight companies receiving Intel Corporation's Supplier Continuous Quality Improvement (SCQI) award for its performance in 2012.  Cabot Microelectronics Corporation is recognized for its significant contributions in providing Intel with CMP slurries and pads, deemed essential to Intel's success. 

Read the press release.