Chemical Mechanical Polishing CMP Slurry

Tungsten CMP Polishing Slurries

Our tungsten slurries are used and produced worldwide for technology nodes ranging from 0.25 μm to 22 nm and beyond. Our next generation of tungsten slurries, under the brand name WIN™ are “tunable”, which allows the customer greater flexibility, improved performance and a reduced cost of ownership. Our tungsten CMP slurries continue to evolve to meet the needs of a sophisticated global customer base that strives to develop electronic devices with greater performance and smaller size.

Click on one of our Tungsten CMP Solutions below to learn more.


CMC W2000 Tungsten CMP Slurry

 Semi-Sperse W2000 Series


CMC W2585 Tungsten CMP Slurry

Semi-Sperse W2585


CMC W6300 Tungsten CMP Slurry

Semi-Sperse W6300






CMC W7000 Tungsten CMP Slurry

WIN W7000


CMC W7300 Tungsten CMP Slurry

WIN W7300 Series


CMC W7500 Tungsten CMP Slurry

WIN W7500 Series





























CMC in Solid State Magazine

Chemical Mechanical Planarization For Metal-gate Integration

CMC's "CMP For Metal-gate Integration" article in Solid State magazine.

For over twenty years of IC manufacturing, the creation of planar device structures has required the use of technologies to reduce topographic variation. Chemical mechanical planarization (CMP) - pressing wafers into rotating pads in the presence of special slurry blends to produce removal through chemically amplified nano-scale abrasion - has become a critical part of modern IC fabrication. Click here to read the full article.