Epic™ D200 Series CMP Polishing Pad
Tunability for Advanced Node Applications
The Epic D200 Series CMP polishing pad is for all polishing applications. The Epic D200 platform has a tunable resin hardness, pore size and porosity to meet the demanding need for advanced node applications.
The D200 polishing pad is based on proprietary material technology and a state-of-the-art continuous manufacturing process designed to improve pad performance, lower the cost of ownership and provide superior quality. Customers in high-volume manufacturing have validated better polishing performance, especially lower defectivity and longer pad life compared to conventional soft pads.
FEATURES & BENEFITS
Best-in-class defectivity: Ultra low-defect
Longer pad life