Copper-Barrier-Aluminum

CMP Polishing Slurries Aluminum Slurry Copper Slurry Barrier SlurryCopper CMP Polishing Slurries

As the leading supplier of Copper CMP slurries, Cabot Microelectronics is focused on developing products with yield enhancement and cost-of-ownership reduction.  Our Copper CMP polishing slurries assume a critical role, influencing both performance and total system cost. Our next-generation EPOCH™ line of Copper slurries provides maximum flexibility to meet specific customer integration requirements.

Barrier CMP Polishing Slurries

As Barrier CMP focus shifts away from early process development to yield enhancement and cost-of-ownership reduction, polishing slurries assume a critical role, influencing both performance and total system cost. Our new line of Sentinel™ slurries for Barrier applications are designed to meet broad technical requirements.

Aluminum CMP Polishing Slurries

Cabot Microelectronics’ Aluminum slurries build on our industry-leading CMP technology and are the result of extensive research and development. CMC’s Aluminum CMP slurries provide advanced node customers with a solution for a critical process step in enabling High-K Metal Gate device integration.

Our Novus™ A7100 slurry contains unique engineered abrasive particles and chemistry to remove aluminum and the complex stack of work-function metals within the transistor gates of advanced semiconductor HKMG (High-K Metal Gate) devices. Novus A7100 was designed to stop polishing on oxide material and therefore minimize Aluminum recess. Novus A7100 is formulated to optimize removal rate, limit recess and meet low defect requirements.