TSV Through-Silicon Via CMP Polishing Slurries
Through-Silicon Via (TSV) is the newest advancement in chip design that enables Moore’s Law of chip scaling. TSV structures connect multiple layers of stacked integrated circuits or 3D chips to deliver better performance, more functionality and smaller packaging of chips while consuming less power. CMC has worked closely with leading edge customers to develop a platform of slurries to enable TSV technology.
This platform of slurries include front side slurries for copper, barrier and nitride CMP and backside slurries for silicon, oxide and polymer CMP.