Epic^® D110-Cu CMP Polishing Pad

Product Summary

The Epic D110-Cu, with an engineered surface finish optimized for the advanced copper CMP application, provides extremely short break-in time (i.e., the time needed to reach steady state performance) and excellent defectivity performance.

The Epic D110-Cu pad is in final development phase and available for sampling to all customers.

Improved Performance, Tool Uptime and Potentially Higher Yield

• Lower defectivity than conventional polishing pads.
• Nearly equivalent removal rates (with some process tweaks), excellent uniformity and erosion performance. 

Lower Cost of Ownership

• Longer pad life (1.3X to 2.5X vs. competitors' pads).
• Competitive pricing.
• Short break-in time.

Superior Quality

• Consistency through continuous manufacturing process.
• Quality checkpoints in place for every raw material, as well for each step of the process.
• Developed, manufactured and tested using Six Sigma methodology.
• Leak-free windows (100% tested).
• Each polishing pad is tested on line for all grooves (depth, pitch and width).

Ease of Adoption and Extendibility

• Available in various configurations, including ISRM and RTPC windows, designs and sizes (10" to 32").
• Applications support provided globally for qualification and performance optimization.
• Post-polish analysis support available to all customers globally.