Epic D150^®-W CMP Polishing Pad

Product Summary

The Epic D150-W CMP, with stronger top sheet/sub-pad adhesion, provides extremely long pad life and enhanced defectivity performance for tungsten CMP applications.

Epic D150-W is a fully commercial product and available to all customers globally. Ample capacity is available with all three manufacturing plants to meet growing demand of this product.

Improved Performance, Tool Uptime and Potentially Higher Yield

• Lower defectivity than conventional polishing pads.
• Nearly equivalent removal rates (with some process tweaks), excellent uniformity and erosion performance.

Lower Cost of Ownership

• Longer pad life (3X vs. competitors' pads).
• Competitive pricing.
• Short break-in time.

Superior Quality

• Consistency through continuous manufacturing process.
• Quality checkpoints in place for every raw material, as well for each step of the process.
• Developed, manufactured and tested using Six Sigma methodology.
• Leak-free windows (100% tested).
• Each pad is tested on line for all grooves (depth, pitch and width).

Ease of Adoption and Extendibility

• Available in various configurations, including ISRM and RTPC windows, designs and sizes (20" and 30").
• Applications support provided globally for qualification and performance optimization.
• Post-polish analysis support available to all customers globally.