Discover Best in Class Features

Epic™ D200 Series CMP Polishing Pad - Tunability for Advanced Node Applications

The Epic D200 Series CMP polishing pads is for all polishing applications. The Epic D200 platform has a tunable resin hardness, pore size and porosity to meet the demanding need for advanced node applications. The D200 polishing pad is based on proprietary material technology and a state-of-the-art continuous manufacturing process designed to improve pad performance, lower the cost of ownership and provide superior quality. Customers in high-volume manufacturing have validated better polishing performance, especially lower defectivity and longer pad life compared to conventional soft pads.


CMP Polishing Pads Manufacturing   Pads Lab 160x160 NoShadow   Pads Lab2 160x160 NoShadow   CMP Polishing Pads Manufacturing Process  


High Performance.  Improved Performance, Tool Uptime and Potentially Higher Yield. 

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Lower Cost of Ownership.  Superior defect performance and pad life throughput. 

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High Quality.  Superior lot to lot consistency.  Rigorous defect and planarity requirements. 

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Ease of Adoption.  Tunable resin hardness, pore size and porosity to meet the demanding need for advanced node applications.

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Epic D200 Series Products

Our Epic D200 Polishing Pads are available for the following applications:

Epic 150


  Epic D200

 Barrier, Copper, Oxide (selective + ILD), Aluminum and TSV

  Epic Buff Pad

 Buff Applications




All Features

Improved Performance, Tool Uptime and Potentially Higher Yield

  • Lower defectivity than conventional soft polishing pads
  • The only soft pad with end point detection FullVision readily available


Lower Cost of Ownership

  • Best-in-class defectivity: Ultra low-defect
  • Longer pad life


Superior Quality

  • Consistency through continuous manufacturing process
  • Quality checkpoints in place for every raw material, as well for each step of the process
  • Developed, manufactured and tested using Six Sigma methodology
  • Leak-free windows (100% tested)
  • Each polishing pad is tested on line for all grooves (depth, pitch and width)


Ease of Adoption and Extendibility

  • Available in various configurations, including ISRM, FullVision™ and RTPC windows, designs and sizes (up to 43")
  • Applications support provided globally for qualification and performance optimization
  • Post-polish analysis support available to all customers globally


Semi-SperseTM W2000


Semi Sperse w2000 Tungsten Slurry

Thank You for Choosing Semi-Sperse W2000 Tungsten Slurry

Cabot Microelectronics trusted for over 200 million liters of Semi-Sperse W2000 tungsten slurry provided to the semiconductor industry. We've reached this significant milestone because of our customers' confidence in CMC as the industry leader in tungsten polishing solutions.

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