EPOCH® TSV-B1000 TSV Series Barrier Slurries
Product Summary
EPOCH TSV-B1000 Series is Cabot Microelectronics' new low-cost colloidal silica slurry platform for TSV barrier polishing. It provides high throughput with high barrier metal and oxide rates and high selectivity to nitride.
Low Cost of Ownership
High barrier/oxide removal rates result in higher throughput and lower cost of ownership.
Broad TSV Integration Application
Copper removal rate can be tuned to meet a wide range of TSV integration requirements.
Robust Process Window
Formulated with high selectivity to nitride, this product has excellent control and wide over-polish window.
Improved Product Yield
High Cu removal rate at a low downforce, resulting in significantly lower defectivity and better product yield.
CMC in Solid State Magazine
CMC chosen by Solid State magazine for November 2010 feature article.
Click here to read the article.