EPOCH® TSV-C1000 Series Copper Slurries
Product Summary
EPOCH TSV-C1000 Series is Cabot Microelectronics' new low-cost offering for TSV copper polishing. It provides high throughput (at low downforce) with low copper dishing and low defectivity. Formulated as a tunable platform to meet a wide range of TSV integration design requirements.
Low Cost of Ownership
Formulated as a high copper removal rate and 5X concentrated slurry to achieve lower point-of-use cost.
Improved Product Yield
High copper removal rate at low downforce, resulting in significantly lower defectivity and better product yield.
Customized Platform
Dishing can be adjusted to meet specific integration requirements.
Broad TSV Integration Application
Profile can be easily adjusted to meet wide range of TSV integration requirements.
CMC in Solid State Magazine
CMC chosen by Solid State magazine for November 2010 feature article.
Click here to read the article.