EPOCH TSV-C101X Series

CMP Semiconductor

EPOCHâ„¢ TSV-C101X Series Copper Slurries

CMC TSV C101X Copper CMP Slurry

Product Summary

EPOCH TSV-C101X Series is Cabot Microelectronics' new low-cost offering for TSV copper polishing. It provides high throughput (at low downforce) with low copper dishing and low defectivity. Formulated as a tunable platform to meet a wide range of TSV integration design requirements.



Features & Benefits

Low Cost of Ownership

Formulated as a high copper removal rate and 5X concentrated slurry to achieve lower point-of-use cost.

Improved Product Yield

High copper removal rate at low downforce, resulting in significantly lower defectivity and better product yield.

Customized Platform

Dishing can be adjusted to meet specific integration requirements.

Broad TSV Integration Application

Profile can be easily adjusted to meet wide range of TSV integration requirements.










CMC in Solid State Magazine

Chemical Mechanical Planarization For Metal-gate Integration

CMC's "CMP For Metal-gate Integration" article in Solid State magazine.

For over twenty years of IC manufacturing, the creation of planar device structures has required the use of technologies to reduce topographic variation. Chemical mechanical planarization (CMP) - pressing wafers into rotating pads in the presence of special slurry blends to produce removal through chemically amplified nano-scale abrasion - has become a critical part of modern IC fabrication. Click here to read the full article.