CMP Semiconductor

EPOCH™ TSV-C101X Series Copper Slurries

CMC TSV C101X Copper CMP Slurry

Product Summary

EPOCH TSV-C101X Series is Cabot Microelectronics' new low-cost offering for TSV copper polishing. It provides high throughput (at low downforce) with low copper dishing and low defectivity. Formulated as a tunable platform to meet a wide range of TSV integration design requirements.

Features & Benefits

Low Cost of Ownership

Formulated as a high copper removal rate and 5X concentrated slurry to achieve lower point-of-use cost.

Improved Product Yield

High copper removal rate at low downforce, resulting in significantly lower defectivity and better product yield.

Customized Platform

Dishing can be adjusted to meet specific integration requirements.

Broad TSV Integration Application

Profile can be easily adjusted to meet wide range of TSV integration requirements.

Semi-SperseTM W2000


Semi Sperse w2000 Tungsten Slurry

Thank You for Choosing Semi-Sperse W2000 Tungsten Slurry

Cabot Microelectronics trusted for over 200 million liters of Semi-Sperse W2000 tungsten slurry provided to the semiconductor industry. We've reached this significant milestone because of our customers' confidence in CMC as the industry leader in tungsten polishing solutions.

>> Learn More about Semi-Sperse W2000