EPOCH TSV-C101X Series is Cabot Microelectronics' new low-cost offering for TSV copper polishing. It provides high throughput (at low downforce) with low copper dishing and low defectivity. Formulated as a tunable platform to meet a wide range of TSV integration design requirements.
Formulated as a high copper removal rate and 5X concentrated slurry to achieve lower point-of-use cost.
High copper removal rate at low downforce, resulting in significantly lower defectivity and better product yield.
Dishing can be adjusted to meet specific integration requirements.
Profile can be easily adjusted to meet wide range of TSV integration requirements.
CMC's "CMP For Metal-gate Integration" article in Solid State magazine.
For over twenty years of IC manufacturing, the creation of planar device structures has required the use of technologies to reduce topographic variation. Chemical mechanical planarization (CMP) - pressing wafers into rotating pads in the presence of special slurry blends to produce removal through chemically amplified nano-scale abrasion - has become a critical part of modern IC fabrication. Click here to read the full article.