EPOCHTM TSV-D1000 Series Oxide/Copper Slurry
EPOCH TSV-D1000 Series is Cabot Microelectronics' new offering for oxide/copper polishing. It provides high throughput with high oxide rate and tunable Cu rate selectivity. Formulated as a tunable platform to meet a wide range of TSV integration design requirements.
Features & Benefits
Low Cost of Ownership
Formulated as a high oxide removal rate with a tunable Cu rate selectivity resulting in higher throughput and lower cost of ownership
Improved Product Yield
Balanced oxide, copper, tantalum and tantalum nitride removal rates with removal rate profiles easy to tune resulting in better product yield
Tunable oxide and copper selectivity can be adjusted to meet specific integration requirements