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EPOCHTM TSV-D1000 Series Oxide/Copper Slurry

CMC TSV D1000 Oxide Copper CMP Slurry

Product Summary

EPOCH TSV-D1000 Series is Cabot Microelectronics' new offering for oxide/copper polishing. It provides high throughput with high oxide rate and tunable Cu rate selectivity. Formulated as a tunable platform to meet a wide range of TSV integration design requirements.

Features & Benefits

Low Cost of Ownership

Formulated as a high oxide removal rate with a tunable Cu rate selectivity resulting in higher throughput and lower cost of ownership

Improved Product Yield

Balanced oxide, copper, tantalum and tantalum nitride removal rates with removal rate profiles easy to tune resulting in better product yield

Customized Platform

Tunable oxide and copper selectivity can be adjusted to meet specific integration requirements

Semi-SperseTM W2000


Semi Sperse w2000 Tungsten Slurry

Thank You for Choosing Semi-Sperse W2000 Tungsten Slurry

Cabot Microelectronics trusted for over 200 million liters of Semi-Sperse W2000 tungsten slurry provided to the semiconductor industry. We've reached this significant milestone because of our customers' confidence in CMC as the industry leader in tungsten polishing solutions.

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