EPOCH TSV-N1000 Series

CMP Semiconductor

EPOCHTM TSV-N1000 Series Nitride Slurry

CMC TSV N1000 Nitride CMP Slurry

Product Summary

EPOCH TSV-N1000 Series is Cabot Microelectronics' new offering for TSV nitride polishing. It provides high throughput offering with low defectivity, high silicon nitride rate and tunable oxide selectivity. Formulated as a tunable platform to meet a wide range of TSV integration design requirements.



Features & Benefits

Low Cost of Ownership

Formulated as a 3X concentrated slurry to achieve low point-of-use cost

Improved Product Yield

Customized removal rate slurries resulting in better product yield

Customized Platform

Selectivity, especially nitride to oxide selectivity, can be adjusted to meet specific integration requirements

Improved Product yield

High dilution up to 3X with excellent final topography, wide over-polish window and low defectivity resulting in better product yield







CMC in Solid State Magazine

Chemical Mechanical Planarization For Metal-gate Integration

CMC's "CMP For Metal-gate Integration" article in Solid State magazine.

For over twenty years of IC manufacturing, the creation of planar device structures has required the use of technologies to reduce topographic variation. Chemical mechanical planarization (CMP) - pressing wafers into rotating pads in the presence of special slurry blends to produce removal through chemically amplified nano-scale abrasion - has become a critical part of modern IC fabrication. Click here to read the full article.