EPOCH TSV-N1000 Series is Cabot Microelectronics' new offering for TSV nitride polishing. It provides high throughput offering with low defectivity, high silicon nitride rate and tunable oxide selectivity. Formulated as a tunable platform to meet a wide range of TSV integration design requirements.
Formulated as a 3X concentrated slurry to achieve low point-of-use cost
Customized removal rate slurries resulting in better product yield
Selectivity, especially nitride to oxide selectivity, can be adjusted to meet specific integration requirements
High dilution up to 3X with excellent final topography, wide over-polish window and low defectivity resulting in better product yield
CMC's "CMP For Metal-gate Integration" article in Solid State magazine.
For over twenty years of IC manufacturing, the creation of planar device structures has required the use of technologies to reduce topographic variation. Chemical mechanical planarization (CMP) - pressing wafers into rotating pads in the presence of special slurry blends to produce removal through chemically amplified nano-scale abrasion - has become a critical part of modern IC fabrication. Click here to read the full article.