CMP Semiconductor

EPOCHTM TSV-PY Series Polymer/Copper Slurries

CMC TSV PY Polymer Copper CMP Slurry

Product Summary

EPOCH TSV-PY Series is Cabot Microelectronics' new offering for TSV polymer/copper polishing. It provides high throughput with very low defectivity. Formulated as a tunable platform to meet a wide range of TSV integration design requirements

Features & Benefits

Improved Product Yield

Customized low defectivity slurries resulting in better product yield

Customized Platform

Removal Rate can be adjusted to meet specific integration requirements

Broad Applications

  • Multiple offerings depending on the polymer type
  • Slurries are available to polish the following polymers (TSV and Non-TSV applications)
    • Polyimides
    • PBO
    • PMMA
    • SOC
    • PEEK
    • BCB
    • PVA
    • PI
    • Cyclic Rubber

For other type of polymer materials, contact CMC.

Semi-SperseTM W2000


Semi Sperse w2000 Tungsten Slurry

Thank You for Choosing Semi-Sperse W2000 Tungsten Slurry

Cabot Microelectronics trusted for over 200 million liters of Semi-Sperse W2000 tungsten slurry provided to the semiconductor industry. We've reached this significant milestone because of our customers' confidence in CMC as the industry leader in tungsten polishing solutions.

>> Learn More about Semi-Sperse W2000