EPOCH TSV-PY Series

CMP Semiconductor

EPOCHTM TSV-PY Series Polymer/Copper Slurries

CMC TSV PY Polymer Copper CMP Slurry

Product Summary

EPOCH TSV-PY Series is Cabot Microelectronics' new offering for TSV polymer/copper polishing. It provides high throughput with very low defectivity. Formulated as a tunable platform to meet a wide range of TSV integration design requirements

 

 

Features & Benefits

Improved Product Yield

Customized low defectivity slurries resulting in better product yield

Customized Platform

Removal Rate can be adjusted to meet specific integration requirements

Broad Applications

  • Multiple offerings depending on the polymer type
  • Slurries are available to polish the following polymers (TSV and Non-TSV applications)
    • Polyimides
    • PBO
    • PMMA
    • SOC
    • PEEK
    • BCB
    • PVA
    • PI
    • Cyclic Rubber

For other type of polymer materials, contact CMC.

 

 

CMC in Solid State Magazine

Chemical Mechanical Planarization For Metal-gate Integration

CMC's "CMP For Metal-gate Integration" article in Solid State magazine.

For over twenty years of IC manufacturing, the creation of planar device structures has required the use of technologies to reduce topographic variation. Chemical mechanical planarization (CMP) - pressing wafers into rotating pads in the presence of special slurry blends to produce removal through chemically amplified nano-scale abrasion - has become a critical part of modern IC fabrication. Click here to read the full article.