EPOCH TSV-PY Series is Cabot Microelectronics' new offering for TSV polymer/copper polishing. It provides high throughput with very low defectivity. Formulated as a tunable platform to meet a wide range of TSV integration design requirements
Customized low defectivity slurries resulting in better product yield
Removal Rate can be adjusted to meet specific integration requirements
For other type of polymer materials, contact CMC.
CMC's "CMP For Metal-gate Integration" article in Solid State magazine.
For over twenty years of IC manufacturing, the creation of planar device structures has required the use of technologies to reduce topographic variation. Chemical mechanical planarization (CMP) - pressing wafers into rotating pads in the presence of special slurry blends to produce removal through chemically amplified nano-scale abrasion - has become a critical part of modern IC fabrication. Click here to read the full article.