EPOCH® TSV-S1000 Series Silicon Slurries
Product Summary
EPOCH TSV-S1000 Series is Cabot Microelectronics' new low-cost, high-throughput offering for TSV backside silicon polishing. It provides non-selectivity between silicon and copper with high silicon/copper rates with low total thickness variation.
Low Cost of Ownership
Formulated as a 10X concentrated slurry with high copper and silicon removal rates resulting in lower cost of ownership.
Broad TSV Integration Application
Tunable copper removal rate to meet wide TSV integration requirements.
Robust Process
Non-selective formulation results in low total thickness variation providing excellent process control.
Improved Product Yield
Low defectivity resulting in better product yield.
CMC in Solid State Magazine
CMC chosen by Solid State magazine for November 2010 feature article.
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