i-Cue^® 600Y-75 Copper Slurry

Product Summary

i-Cue 600Y-75 is Cabot Microelectronics' low-solid, low-defect offering for copper polishing. It provides high throughput and high selectivity to barrier metal.

Improved Product Yield

Specially formulated with low solids to achieve lower defectivity resulting in better product yield.

Low Cost of Ownership

High removal rate of copper and low point-of-use cost results in an overall lower cost of ownership.

Robust Process Control

High selectivity to barrier provides excellent control over a wide polishing window.

Ease of Use

Colloidally stable formulation that is easy to mix and handle.