i-Cue® B6618 Barrier Slurry
Product Summary
i-Cue B6618 is Cabot Microelectronics' low defectivity and high throughput slurry for copper barrier CMP polishing. It provides tunable selectivity and lower dishing and erosion performance.
Competitive Cost of Ownership
High throughput and low point-of-use cost results in an overall competitive cost of ownership for customers.
Improved Product Yield
Formulated to achieve lower defectivity resulting in high product yield.
Robust Process Control
Tunable selectivity among copper, barrier, oxide/low-k results in excellent control and robust over-polish window.
Ease of Use
Colloidally stable formulation that is easy to mix and handle.
CMC in Solid State Magazine
CMC chosen by Solid State magazine for November 2010 feature article.
Click here to read the article.