i-Cue B7000 Series

Wafer CMP Semiconductor

i-Cue™ B7000 Series Barrier Slurry

CMC iCue B7000 Barrier CMP Slurry

Product Summary

i-Cue B7000 Series is Cabot Microelectronics' low-k compatible copper barrier polishing slurry. It provides minimal k-shift, optimized Rs performance, excellent topography correction capability and low defectivity with high oxide rate at low downforce. 



Features & Benefits

Improved Product Yield

Formulated to achieve lower defectivity and excellent topography correction for better product yield.

Robust Process Window

Tunable selectivity among copper, barrier, oxide/low-k results in excellent control and robust over-polish window.

Broad Technology Node Application

Optimized Rs performance to meet the requirements of a broad range of applications nodes.









CMC in Solid State Magazine

Chemical Mechanical Planarization For Metal-gate Integration

CMC's "CMP For Metal-gate Integration" article in Solid State magazine.

For over twenty years of IC manufacturing, the creation of planar device structures has required the use of technologies to reduce topographic variation. Chemical mechanical planarization (CMP) - pressing wafers into rotating pads in the presence of special slurry blends to produce removal through chemically amplified nano-scale abrasion - has become a critical part of modern IC fabrication. Click here to read the full article.