Wafer CMP Semiconductor

i-Cue™ B7000 Series Barrier Slurry

CMC iCue B7000 Barrier CMP Slurry

Product Summary

i-Cue B7000 Series is Cabot Microelectronics' low-k compatible copper barrier polishing slurry. It provides minimal k-shift, optimized Rs performance, excellent topography correction capability and low defectivity with high oxide rate at low downforce. 

 Features & Benefits

Improved Product Yield

Formulated to achieve lower defectivity and excellent topography correction for better product yield.

Robust Process Window

Tunable selectivity among copper, barrier, oxide/low-k results in excellent control and robust over-polish window.

Broad Technology Node Application

Optimized Rs performance to meet the requirements of a broad range of applications nodes.


Semi-SperseTM W2000


Semi Sperse w2000 Tungsten Slurry

Thank You for Choosing Semi-Sperse W2000 Tungsten Slurry

Cabot Microelectronics trusted for over 200 million liters of Semi-Sperse W2000 tungsten slurry provided to the semiconductor industry. We've reached this significant milestone because of our customers' confidence in CMC as the industry leader in tungsten polishing solutions.

>> Learn More about Semi-Sperse W2000