i-Cue B7000 Series is Cabot Microelectronics' low-k compatible copper barrier polishing slurry. It provides minimal k-shift, optimized Rs performance, excellent topography correction capability and low defectivity with high oxide rate at low downforce.
Formulated to achieve lower defectivity and excellent topography correction for better product yield.
Tunable selectivity among copper, barrier, oxide/low-k results in excellent control and robust over-polish window.
Optimized Rs performance to meet the requirements of a broad range of applications nodes.
CMC's "CMP For Metal-gate Integration" article in Solid State magazine.
For over twenty years of IC manufacturing, the creation of planar device structures has required the use of technologies to reduce topographic variation. Chemical mechanical planarization (CMP) - pressing wafers into rotating pads in the presence of special slurry blends to produce removal through chemically amplified nano-scale abrasion - has become a critical part of modern IC fabrication. Click here to read the full article.