i-Cue® C7092 Copper Slurry
Product Summary
i-Cue C7092 is Cabot Microelectronics' low-cost offering for copper polishing. It combines a balanced approach of chemical and mechanical performance to provide high planarization efficiency and lower defectivity.
Low Cost of Ownership
Formulated as a 4X concentrated slurry to reduce shipping and handling cost and to achieve lower point-of-use cost.
Broad Technology Node Application
Excellent planarization that meets the performance requirements for 130nm to 45nm technology nodes.
Robust Process Control
Formulated with high selectivity to barrier, this product has excellent control and robust over-polish window.
Improved Product Yield
Lower dishing and erosion from this product results in better product yield.
CMC in Solid State Magazine

CMC chosen by Solid State magazine for November 2010 feature article.
Click here to read the article.





