On-Site Polishing Services

Cabot Microelectronics is pleased to offer contract wafer polishing services. We provide high precision Chemical Mechanical Planarization on wafers from 50 to 100 mm in diameter for all crystal faces of interest. Rapid prototyping as well as large volumes are well within our capability. Current HVM capacity is serviced on a 30" single side polisher with the following capacity:

• 2" or 50 mm wafers 1600 per month
• 3" or 76 mm wafers 1200 per month
• 4" or 100 mm wafers 1000 per month

Wafers are polished to your specifications then cleaned and inspected prior to packaging. Our typical inspection equipment is listed below.

Nanoscale Metrology Services

Including the following sophisticated measurement and analysis with:

• Scanning Electron Microscopy (SEM)
• Atomic Force Microscopy (AFM)
• Candela optical surface analyzer
• Wyko white light interferometer
• Additional capabilities for measuring Surface and Embedded Defects, Surface Accuracies, Surface Roughness and more