Cabot Microelectronics is pleased to offer contract wafer polishing services. We provide high precision Chemical Mechanical Planarization on wafers from 50 to 100 mm in diameter for all crystal faces of interest. Rapid prototyping as well as large volumes are well within our capability. Current HVM capacity is serviced on a 30" single side polisher with the following capacity:
Wafers are polished to your specifications then cleaned and inspected prior to packaging. Our typical inspection equipment is listed below.
Including the following measurement and analysis with:
CMC's "CMP For Metal-gate Integration" article in Solid State magazine.
For over twenty years of IC manufacturing, the creation of planar device structures has required the use of technologies to reduce topographic variation. Chemical mechanical planarization (CMP) - pressing wafers into rotating pads in the presence of special slurry blends to produce removal through chemically amplified nano-scale abrasion - has become a critical part of modern IC fabrication. Click here to read the full article.