On-Site Polishing Services

Cabot Microelectronics is pleased to offer contract wafer polishing services. We provide high precision Chemical Mechanical Planarization on wafers from 50 to 100 mm in diameter for all crystal faces of interest. Rapid prototyping as well as large volumes are well within our capability. Current HVM capacity is serviced on a 30" single side polisher with the following capacity:

  • 2" or 50 mm wafers 1600 per month
  • 3" or 76 mm wafers 1200 per month
  • 4" or 100 mm wafers 1000 per month

Wafers are polished to your specifications then cleaned and inspected prior to packaging. Our typical inspection equipment is listed below.

Nanoscale Metrology Services

Including the following measurement and analysis with:

  • Scanning Electron Microscopy (SEM)
  • Atomic Force Microscopy (AFM)
  • Candela optical surface analyzer
  • Wyko white light interferometer
  • Additional capabilities for measuring Surface and Embedded Defects, Surface Accuracies, Surface Roughness and more

CMC OnSite_Polishing_Services

Semi-SperseTM W2000


Semi Sperse w2000 Tungsten Slurry

Thank You for Choosing Semi-Sperse W2000 Tungsten Slurry

Cabot Microelectronics trusted for over 200 million liters of Semi-Sperse W2000 tungsten slurry provided to the semiconductor industry. We've reached this significant milestone because of our customers' confidence in CMC as the industry leader in tungsten polishing solutions.

>> Learn More about Semi-Sperse W2000