Wafer CMP Polishing


Semi-Sperse™ W6300 Slurry

CMC W6300 Tungsten CMP Slurry

Product Summary

Semi-Sperse W6300 is a selective, high-purity slurry based on fumed silica and hydrogen peroxide technology. It provides improved planarity and cost of ownership for 90nm to 65nm nodes.


Features & Benefits

Improvement in Product Yield

  • Specially formulated high-purity slurry to achieve lower defectivity and excellent cleanability resulting in better product yield.
  • 50% reduction in defectivity (as compared to W2000).
  • 50% reduction in erosion (as compared to W2000).

Lower Cost of Ownership

  • Formulated as 2x concentrated slurry to reduce shipping and handling cost and achieve lower point-of-cost use.

Ease of Use

  • Colloidally stable formulation that is easy to mix, filter and handle.

Semi-SperseTM W2000


Semi Sperse w2000 Tungsten Slurry

Thank You for Choosing Semi-Sperse W2000 Tungsten Slurry

Cabot Microelectronics trusted for over 200 million liters of Semi-Sperse W2000 tungsten slurry provided to the semiconductor industry. We've reached this significant milestone because of our customers' confidence in CMC as the industry leader in tungsten polishing solutions.

>> Learn More about Semi-Sperse W2000