Semi-Sperse^® W6300 Slurry

Product Summary

Semi-Sperse W6300 is a selective, high-purity slurry based on fumed silica and hydrogen peroxide technology. It provides improved planarity and cost of ownership for 90nm to 65nm nodes.

For more advanced tungsten applications requiring a selective approach, CMC is currently recommending WIN W7000 slurry.

Improvement in Product Yield

• Specially formulated high-purity slurry to achieve lower defectivity and excellent cleanability resulting in better product yield.
• 50% reduction in defectivity (as compared to W2000).
• 50% reduction in erosion (as compared to W2000).

Lower Cost of Ownership

• Formulated as 2x concentrated slurry to reduce shipping and handling cost and achieve lower point-of-cost use.

Ease of Use

• Colloidally stable formulation that is easy to mix, filter and handle.