Semi-Sperse W6300 is a selective, high-purity slurry based on fumed silica and hydrogen peroxide technology. It provides improved planarity and cost of ownership for 90nm to 65nm nodes.
CMC's "CMP For Metal-gate Integration" article in Solid State magazine.
For over twenty years of IC manufacturing, the creation of planar device structures has required the use of technologies to reduce topographic variation. Chemical mechanical planarization (CMP) - pressing wafers into rotating pads in the presence of special slurry blends to produce removal through chemically amplified nano-scale abrasion - has become a critical part of modern IC fabrication. Click here to read the full article.