Sentinel B8000 Series

Wafer CMP Semiconductor

Sentinel B8000 Series Barrier Slurries

CMC Sentinel B8000 Barrier CMP Slurry

Product Summary

Sentinel B8000 Series is Cabot Microelectronics' low-cost and low-defectivity slurry for copper barrier CMP polishing. It's a mildly acidic colloidal silica-based slurry, formulated to provide tunable removal rate selectivity for oxide, copper and low-k films.



Features & Benefits

Better Corrosion and K-Effective Shift

Formulated as a mildly acidic platform to offer better corrosion and k-effective shift for advanced low-k applications.

Improved Product Yield

Specially formulated with colloidal silica to achieve lower defectivity resulting in better product yield.

Competitive Cost of Ownership

Formulated as a 2X concentrated slurry to reduce shipping and handling cost and to achieve lower point-of-use cost.

Tunable Slurry for Multi-application Use       

Removal rate of ULK can be adjusted from moderate to low by proprietary additives to meet specific integration designs. Can be used for stop-on low-k or stop-in low-k application.

Ease of Use

Tunable and controlled Cu rate at standard peroxide levels.

CMC in Solid State Magazine

Chemical Mechanical Planarization For Metal-gate Integration

CMC's "CMP For Metal-gate Integration" article in Solid State magazine.

For over twenty years of IC manufacturing, the creation of planar device structures has required the use of technologies to reduce topographic variation. Chemical mechanical planarization (CMP) - pressing wafers into rotating pads in the presence of special slurry blends to produce removal through chemically amplified nano-scale abrasion - has become a critical part of modern IC fabrication. Click here to read the full article.