Sentinel™ B8000 Series Barrier Slurries
Sentinel B8000 Series is Cabot Microelectronics' low-cost and low-defectivity slurry for copper barrier CMP polishing. It's a mildly acidic colloidal silica-based slurry, formulated to provide tunable removal rate selectivity for oxide, copper and low-k films.
Features & Benefits
Better Corrosion and K-Effective Shift
Formulated as a mildly acidic platform to offer better corrosion and k-effective shift for advanced low-k applications.
Improved Product Yield
Specially formulated with colloidal silica to achieve lower defectivity resulting in better product yield.
Competitive Cost of Ownership
Formulated as a 2X concentrated slurry to reduce shipping and handling cost and to achieve lower point-of-use cost.
Tunable Slurry for Multi-application Use
Removal rate of ULK can be adjusted from moderate to low by proprietary additives to meet specific integration designs. Can be used for stop-on low-k or stop-in low-k application.
Ease of Use
Tunable and controlled Cu rate at standard peroxide levels.