Wafer CMP Semiconductor

Sentinel B8000 Series Barrier Slurries

CMC Sentinel B8000 Barrier CMP Slurry

Product Summary

Sentinel B8000 Series is Cabot Microelectronics' low-cost and low-defectivity slurry for copper barrier CMP polishing. It's a mildly acidic colloidal silica-based slurry, formulated to provide tunable removal rate selectivity for oxide, copper and low-k films.

 Features & Benefits

Better Corrosion and K-Effective Shift

Formulated as a mildly acidic platform to offer better corrosion and k-effective shift for advanced low-k applications.

Improved Product Yield

Specially formulated with colloidal silica to achieve lower defectivity resulting in better product yield.

Competitive Cost of Ownership

Formulated as a 2X concentrated slurry to reduce shipping and handling cost and to achieve lower point-of-use cost.

Tunable Slurry for Multi-application Use       

Removal rate of ULK can be adjusted from moderate to low by proprietary additives to meet specific integration designs. Can be used for stop-on low-k or stop-in low-k application.

Ease of Use

Tunable and controlled Cu rate at standard peroxide levels.

Semi-SperseTM W2000


Semi Sperse w2000 Tungsten Slurry

Thank You for Choosing Semi-Sperse W2000 Tungsten Slurry

Cabot Microelectronics trusted for over 200 million liters of Semi-Sperse W2000 tungsten slurry provided to the semiconductor industry. We've reached this significant milestone because of our customers' confidence in CMC as the industry leader in tungsten polishing solutions.

>> Learn More about Semi-Sperse W2000