Sentinel B8000 Series is Cabot Microelectronics' low-cost and low-defectivity slurry for copper barrier CMP polishing. It's a mildly acidic colloidal silica-based slurry, formulated to provide tunable removal rate selectivity for oxide, copper and low-k films.
Formulated as a mildly acidic platform to offer better corrosion and k-effective shift for advanced low-k applications.
Specially formulated with colloidal silica to achieve lower defectivity resulting in better product yield.
Formulated as a 2X concentrated slurry to reduce shipping and handling cost and to achieve lower point-of-use cost.
Removal rate of ULK can be adjusted from moderate to low by proprietary additives to meet specific integration designs. Can be used for stop-on low-k or stop-in low-k application.
Tunable and controlled Cu rate at standard peroxide levels.
CMC's "CMP For Metal-gate Integration" article in Solid State magazine.
For over twenty years of IC manufacturing, the creation of planar device structures has required the use of technologies to reduce topographic variation. Chemical mechanical planarization (CMP) - pressing wafers into rotating pads in the presence of special slurry blends to produce removal through chemically amplified nano-scale abrasion - has become a critical part of modern IC fabrication. Click here to read the full article.