Wafer CMP Semiconductor

Sentinel B9000 Series Ruthenium Barrier Slurry

CMC Sentinel Ruthenium Barrier B9000 CMP Slurry

Product Summary

Sentinel B9000 Series is Cabot Microelectronics' newest Ruthenium CMP slurry. It provides high to medium selectivity of CVD/ALD deposited ruthenium to oxide without any galvanic corrosion. This formulation is compatible with copper and tantalum.

 Features & Benefits 

Compatible to Other Metals

Compatible to copper and tantalum with no corrosion.

Competitive Cost of Ownership

High ruthenium removal rate results in higher through-put and lower cost of ownership.

Tunable Slurry for Multi-application Use       

Removal rate of ULK can be adjusted from moderate to low by proprietary additives to meet specific integration designs. Can be used for stop-on low-k or stop-in low-k application.

Ease of Use

Colloidal stable formulation that is easy to mix and handle.

Semi-SperseTM W2000


Semi Sperse w2000 Tungsten Slurry

Thank You for Choosing Semi-Sperse W2000 Tungsten Slurry

Cabot Microelectronics trusted for over 200 million liters of Semi-Sperse W2000 tungsten slurry provided to the semiconductor industry. We've reached this significant milestone because of our customers' confidence in CMC as the industry leader in tungsten polishing solutions.

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