The SiLECT FP3000 Series is Cabot Microelectronics' new low-cost offering for silicon wafer final step polishing. These slurries are ultra-high-purity colloidal silica slurries formulated for low defectivity, low haze and significant reduction in cost of ownership. CMC tailors our slurry for optimal performance based on process conditions, pad type and customer-specific requirements.
- Ultra High Purity Colloidal Silica Slurry
- Colloidally Stable Concentrate
- Basic pH
- Shear Tolerant
CMC's "CMP For Metal-gate Integration" article in Solid State magazine.
For over twenty years of IC manufacturing, the creation of planar device structures has required the use of technologies to reduce topographic variation. Chemical mechanical planarization (CMP) - pressing wafers into rotating pads in the presence of special slurry blends to produce removal through chemically amplified nano-scale abrasion - has become a critical part of modern IC fabrication. Click here to read the full article.