SiLECT FP3000 Series

Wafer CMP Semiconductor

SiLECTâ„¢ FP3000 Series Slurries

CMC FP3000 Final Polish Silicon Wafer CMP SlurryProduct Summary

The SiLECT FP3000 Series is Cabot Microelectronics' new low-cost offering for silicon wafer final step polishing. These slurries are ultra-high-purity colloidal silica slurries formulated for low defectivity, low haze and significant reduction in cost of ownership. CMC tailors our slurry for optimal performance based on process conditions, pad type and customer-specific requirements.


- Ultra High Purity Colloidal Silica Slurry
- Colloidally Stable Concentrate
- Basic pH
- Shear Tolerant

 

Features & Benefits

Improved Device Reliability

  • Meets industry standard for all metals including Cu and Ni.

Improvement in Product Yield

  • Specially formulated to achieve lower defectivity and haze resulting in better product yield.

Lower Cost of Ownership

  • Formulated as 35X (up to) concentrated slurry to reduce shipping and handling cost and to achieve lower point-of-use cost.

Tunable Platform to Meet Customer Specific Requirements

  • Removal rate and haze are tunable to meet specific requirements.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CMC in Solid State Magazine

Chemical Mechanical Planarization For Metal-gate Integration

CMC's "CMP For Metal-gate Integration" article in Solid State magazine.

For over twenty years of IC manufacturing, the creation of planar device structures has required the use of technologies to reduce topographic variation. Chemical mechanical planarization (CMP) - pressing wafers into rotating pads in the presence of special slurry blends to produce removal through chemically amplified nano-scale abrasion - has become a critical part of modern IC fabrication. Click here to read the full article.