Products

Our polishing slurries and pads are at the heart of a process known as chemical mechanical planarization (CMP). Using our slurries and polishing pads, manufacturers planarize, or level and smooth, many of the multiple layers that are built upon silicon wafers to produce IC devices. CMP is also used to remove excess materials during the formation of intricate structures within the IC device, leaving only that necessary for circuit integrity. Hard disk drive manufacturers use a similar process to smooth the surface off substrate disks before depositing magnetic media.

Engineered Surface Finishes

Engineered Surface Finishes is a group of Cabot Microelectronics Corporation, the world's leading supplier of chemical mechanical planarization materials and processes for the semiconductor industry.

With over $300 million in annual revenue and 500 employees in research and production facilities worldwide, Cabot Microelectronics has long been a pioneer and leader in surface finishing technology. Through annual investment of 15% of revenue and 30% of the workforce, our world-class scientists and engineers focus on:

• advancing surface finishing through the application of novel enabling technologies
• the development of optimized processing solutions for specific substrates

We employ Six Sigma in combination with other quality processes to ensure added value and outstanding customer satisfaction.

ESF™ research, development and applications teams specialize in developing unprecedented atomic-scale finishes on Metals, Glass, Compound Semiconductors, Ceramics, and other materials. Our new proprietary Advanced Nanoscale Surface Technology is designed to deliver Angstrom level finishes for the special needs of the Aerospace, Communications, Defense/Military, Laser, Medical, MEMS, Metrology, Optics, Robotics and Other Industries.

For more information, please visit our website, www.ensurfin.com