Wafer CMP Polishing


WIN™ W7000 Slurry

CMC W7000 Tungsten CMP Slurry

Product Summary

WIN W7000 utilizes fumed silica abrasives and CMC etch inhibitor technology to provide best–in-class planarization performance (e.g. less than 100 Å erosion) with minimization/elimination of edge-over-erosion (EOE) and a wide over-polish window for advance nodes. Full benefits of the high-selectivity technology have been obtained using engineered fumed silica coupled with CMP process optimization. 

Features & Benefits

Improvement in Product Yield

  • Specially formulated high-purity slurry to achieve excellent cleanability resulting in better product yield.
  • > 80% reduction in erosion and elimination of edge-over-erosion (as compared to W2000).

Ease of Use

  • Colloidally stable formulation that is easy to mix, filter and handle.

Semi-SperseTM W2000


Semi Sperse w2000 Tungsten Slurry

Thank You for Choosing Semi-Sperse W2000 Tungsten Slurry

Cabot Microelectronics trusted for over 200 million liters of Semi-Sperse W2000 tungsten slurry provided to the semiconductor industry. We've reached this significant milestone because of our customers' confidence in CMC as the industry leader in tungsten polishing solutions.

>> Learn More about Semi-Sperse W2000