WIN™ W7000 Slurry
WIN W7000 utilizes fumed silica abrasives and CMC etch inhibitor technology to provide best–in-class planarization performance (e.g. less than 100 Å erosion) with minimization/elimination of edge-over-erosion (EOE) and a wide over-polish window for advance nodes. Full benefits of the high-selectivity technology have been obtained using engineered fumed silica coupled with CMP process optimization.
Features & Benefits
Improvement in Product Yield
- Specially formulated high-purity slurry to achieve excellent cleanability resulting in better product yield.
- > 80% reduction in erosion and elimination of edge-over-erosion (as compared to W2000).
Ease of Use
- Colloidally stable formulation that is easy to mix, filter and handle.