WIN® W7000 Slurry
Product Summary
WIN W7000 utilizes fumed silica abrasives and CMC etch inhibitor technology to provide best–in-class planarization performance (e.g. less than 100 Å erosion) with minimization/elimination of edge-over-erosion (EOE) and a wide over-polish window for advance nodes. Full benefits of the high-selectivity technology have been obtained using engineered fumed silica coupled with CMP process optimization.
Improvement in Product Yield
- Specially formulated high-purity slurry to achieve excellent cleanability resulting in better product yield.
- > 80% reduction in erosion and elimination of edge-over-erosion (as compared to W2000).
Ease of Use
- Colloidally stable formulation that is easy to mix, filter and handle.
CMC in Solid State Magazine
CMC chosen by Solid State magazine for November 2010 feature article.
Click here to read the article.