WIN^® W7200 Series Slurries

Product Summary

The WIN W7200 Series is Cabot Microelectronics' new low-cost offering for tungsten buff polishing. The WIN W7200 platform includes precipitated colloidal silica particle to provide excellent planarization performance, ultra-low defectivity and tunability at a significantly competitive cost of ownership than current leading-edge products.

WIN W7200 is currently in development and will lead to multiple customized products. Please contact Cabot Microlectronics to provide your detailed requirements.

Improvement in Product Yield

• > 80% reduction in defectivity (as compared to W2000).
• > 80% reduction in erosion and elimination of edge-over-erosion (as compared to W2000) to meet the requirements of advance technology nodes.

Lower Cost of Ownership

• Formulated as a concentrated slurry to reduce shipping and handling cost and to achieve lower point-of-use cost.

Tunability Performance for Advance Technology Nodes

• Tunable with ability to polish or stop on new materials for advance nodes.

Robust Process Control

• Excellent over-polish window to meet the requirements of a variety of integration designs.