WIN^® W7300-B21 Slurry

Product Summary

WIN W7300-B21 is a non-selective slurry designed for tungsten bulk polishing. WIN W7300-B21 includes ultra-pure colloidal silica particle to provide excellent planarization performance and low defectivity. This slurry is ideal for customers who require a single slurry approach for a two-platen process.

For advanced tungsten applications requiring a non-selective approach and low cost of ownership, CMC is currently recommending WIN W7500 series.

Improvement in Product Yield

• > 70% reduction in defectivity (as compared to W2000).
• > 80% reduction in erosion and elimination of edge-over-erosion (as compared to W2000) to meet the requirements of advance technology nodes.

Robust Process Control

• Excellent over-polish window to meet the requirements of a variety of integration designs.

Tunability Performance for Advance Technology Nodes

• Tungsten/PETEOS removal rates are tunable to meet the requirements advanced technology nodes.

Ease of Use

• Colloidally stable formulation that is easy to mix, filter and handle.