WIN^® W7300 Series Slurries

Product Summary

WIN W7300-A9 is a non-selective slurry designed for oxide buff polishing for 90 and 65nm technology nodes. WIN® W7300-A9 includes ultra-pure colloidal silica particle to provide excellent planarization performance, ultra low defectivity, and tunability.

For advanced tungsten applications requiring an oxide buff polishing, CMC is currently recommending WIN W7200 series.

Improvement in Product Yield

• Specially formulated as a high-purity slurry to achieve excellent cleanability resulting in better product yield.
• > 80% reduction in erosion and elimination of edge-over-erosion (as compared to W2000).
• > 80% reduction in defectivity (as compared to W2000).

Robust Process Control

• Excellent over-polish window to meet the requirements of a variety of integration designs.

Tunability Performance for Advance Technology Nodes

• Tungsten/PETEOS/SiN removal rates are tunable to meet the requirements for 90 and 45nm technology nodes.

 Ease of Use

• Colloidally stable formulation that is easy to mix, filter and handle.