WIN^® W7500 Slurry

Product Summary

The WIN W7500 Series is Cabot Microelectronics' new low-cost offering for tungsten bulk polishing. The WIN W7500 platform includes precipitated colloidal silica particle to provide excellent planarization performance, low defectivity and tunability at a significantly competitive cost of ownership than current leading-edge products.

Lower Cost of Ownership

• Formulated as a 3X concentrated slurry to reduce shipping and handling cost and to achieve lower point-of-use cost.

Improvement in Product Yield

• > 70% reduction in defectivity (as compared to W2000).
• > 80% reduction in erosion and elimination of edge-over-erosion (as compared to W2000) to meet the requirements of advance technology nodes.

Robust Process Control

• Excellent over-polish window to meet the requirements of a variety of integration designs.

Tunability Performance for Advance Technology Nodes

• Tungsten/PETEOS removal rates are tunable to meet the requirements for advanced technology nodes.

Ease of Use

• Colloidally stable formulation that is easy to mix, filter and handle.