WIN W7500 Series

Wafer CMP Polishing

 

WIN™ W7500 Series Slurry

CMC W7500 Tungsten CMP Slurry

Product Summary

The WIN W7500 Series is Cabot Microelectronics' new low-cost offering for tungsten bulk polishing. The WIN W7500 platform includes precipitated colloidal silica particle to provide excellent planarization performance, low defectivity and tunability at a significantly competitive cost of ownership than current leading-edge products.

 

  

 

Features & Benefits

Lower Cost of Ownership

  • Formulated as a concentrated slurry to reduce shipping and handling cost and to achieve lower point-of-use cost.

Improvement in Product Yield

  • > 80% reduction in defectivity (as compared to W2000).
  • > 80% reduction in erosion and elimination of edge-over-erosion (as compared to W2000) to meet the requirements of advance technology nodes.

Robust Process Control

  • Excellent over-polish window to meet the requirements of a variety of integration designs.

Tunability Performance for Advance Technology Nodes

  • Tungsten/PETEOS removal rates are tunable to meet the requirements for advanced technology nodes.

Ease of Use

  • Colloidally stable formulation that is easy to mix, filter and handle.


CMC in Solid State Magazine

Chemical Mechanical Planarization For Metal-gate Integration

CMC's "CMP For Metal-gate Integration" article in Solid State magazine.

For over twenty years of IC manufacturing, the creation of planar device structures has required the use of technologies to reduce topographic variation. Chemical mechanical planarization (CMP) - pressing wafers into rotating pads in the presence of special slurry blends to produce removal through chemically amplified nano-scale abrasion - has become a critical part of modern IC fabrication. Click here to read the full article.